Flexible PCB

Printed circuit innovations, the first is the PCB product and market innovation.

Printed circuit innovation, is based on technological innovation. Noise printed electronic circuit (PEC) to the PCB products and processes have brought revolutionary changes.

Printed circuit board (PCB) has been indispensable in modern electronic equipment accessories, high-end regardless of the sea world of electronic equipment, or household appliances and electronic toys, electronic components are missed loads and signal the PCB, the PCB is as the development of electronic information industry development.

Printed circuit innovations, the first is that PCB product and market innovations. PCB first product is a single panel, insulation board, only a layer of conductor, line widths in millimeters, was used in commercial semiconductor (transistor) radio. After that TV, the advent of computers, PCB product innovation followed, double-panel, multilayer insulation board with two-story or multi-conductor line width is gradually reduced. To meet the miniaturization of electronic devices, lightweight development, there was the flexible PCB, and rigid flex PCB.

Now, PCB's major markets in the computer (computer and peripherals), communications equipment (base stations and handheld devices, etc.), home electronics (TVs, cameras, games, etc.) and the areas of automotive electronics, PCB and multilayer products High Density Interconnect (HDI) board based. As computer technology to high-speed and large capacity, multi-function mobile phones to intelligent 3D high-definition television technology to the car to the high security and intelligent direction, HDI PCB features from wires into electronic circuit functions that the PCB product lines in addition to basic conductor, but also include resistors, capacitors and other passive components and active components such as IC chips. HDI PCB is a new generation of embedded components within the PCB with components. More suitable for high frequency PCB generation high-speed signal transmission applications, PCB layer will contain the fiber and waveguide, constitutes a 40GHz signal transmission over the optical PCB.

Because of PCB product innovation, so we welcome the development of printed circuits one by one spring. Intelligent mobile devices will have embedded PCB climax, LED energy-efficient lighting will have metal-based PCB's climax, books and film flexible circuit boards display brings to a climax.

Printed circuit innovation, is based on technological innovation. Traditional PCB manufacturing technology is copper etching method (minus France), which uses copper clad insulating substrate by chemical solution to remove unwanted copper layer etching, leaving the need for the formation of the copper conductor line graph; for double-sided and multi- laminate layer interconnection is achieved by the drilling and plating of copper conduction of. Now this traditional process has been difficult to adapt to micron-level fine HDI board production line is difficult to achieve rapid and low-cost production, but also difficult to achieve energy saving, green production purposes, only a technical innovation can change that.

High-density PCB technology is the eternal theme. High density is characterized by finer lines, smaller interconnect hole, more and more thin layers. Such as the PCB is now the line width / line capacity from the conventional refinement from 100μm to 75μm, 50μm, a few years will be refined to 25μm, 20μm, therefore, must be carried out on the copper foil etching process innovation.

For printed circuit technology innovation, people have been pursuing a half Addition Technology Canadian became law, that the formation of insulating substrate layer deposition of copper line graphics, this is the traditional method of improving minus, although it has to be a lot of progress energy, and the cost is higher. Innovation Way is the new printed electronic circuit (PEC), its PCB products and processes to bring about a revolutionary change. Printed electronic circuit technology uses pure graphics printing method for electronic circuits that use screen printing or offset printing or ink-jet printing process, the functional ink (conductive ink, semiconductor inks, dielectric inks, etc.) printed on the insulating substrate on, to obtain the required electronic circuits. The technology simplifies the production process, saving raw materials, reduce pollution, reduce production costs, if the equipment into roll (RolltoRoll) processing equipment, can help achieve high-volume, low-cost production.

Printed electronic circuit technology will enable the continuous development of PCB industry next level.